20231008_HangBiao_emb/资料/08_STM32代码/04_BC26接入阿里云发温湿度代码/USER/wdg.d
2023-10-08 16:59:56 +08:00

17 lines
633 B
Makefile

.\wdg.o: ..\HARDWARE\WDG\wdg.c
.\wdg.o: ..\HARDWARE\WDG\wdg.h
.\wdg.o: ..\SYSTEM\sys\sys.h
.\wdg.o: ..\USER\stm32f10x.h
.\wdg.o: ..\CORE\core_cm3.h
.\wdg.o: d:\Keil_v5\ARM\ARMCC\Bin\..\include\stdint.h
.\wdg.o: ..\USER\system_stm32f10x.h
.\wdg.o: ..\USER\stm32f10x_conf.h
.\wdg.o: ..\STM32F10x_FWLib\inc\stm32f10x_can.h
.\wdg.o: ..\USER\stm32f10x.h
.\wdg.o: ..\STM32F10x_FWLib\inc\stm32f10x_fsmc.h
.\wdg.o: ..\STM32F10x_FWLib\inc\stm32f10x_gpio.h
.\wdg.o: ..\STM32F10x_FWLib\inc\stm32f10x_rcc.h
.\wdg.o: ..\STM32F10x_FWLib\inc\stm32f10x_usart.h
.\wdg.o: ..\STM32F10x_FWLib\inc\misc.h
.\wdg.o: ..\STM32F10x_FWLib\inc\stm32f10x_iwdg.h